We transform your challenges into innovative solutions

To meet the demands of telecommunications electronics, our engineering excellence is built around Design for Excellence (DFx), ensuring that your products are not only functional but optimized for their entire life cycle.

• Design for Manufacturing and Assembly (DFM & DFA): We optimize your designs for manufacturing and assembly, which is critical for high-density electronic boards.
• RF Optimization and Component Placement: Our expertise includes the RF optimization of assembled systems and a meticulous layout of components on the board (PCBA). This layout is essential for reducing electromagnetic interference, thereby ensuring the reliability and superior quality of your products.
• Proactive Supply Chain Management (DFP): We perform an in-depth analysis of the Bill of Materials (BOM) to implement DFP strategies, securing your supply sources and anticipating obsolescence.
• Accelerated Prototyping: Prototyping is a crucial element of electronics innovation. We accelerate the transition from idea to functional model.

Telecommunications infrastructure demands exceptional robustness and longevity. We provide a full A-to-Z offering, from engineering to box build.

• Printed Circuit Board Assembly (PCBA): We master printed circuit board assembly. Our automated assembly lines integrate artificial intelligence and robotics for high-speed mechanical assembly.Circuit Protection (Potting and Coating): To protect your products from outdoor or harsh environments, we offer encapsulation (Potting) and conformal coating services.Traceability and Quality: Transparent traceability is integrated at every step, and our procedures include inspection of incoming materials and outgoing products to guarantee quality upon delivery.

In the field of complex electronics, bugs can appear after several billion executed cycles, making debugging arduous. Our testing expertise aims to guarantee uninterrupted performance.

• Electronic fault tolerance: We possess expertise in designing fault-tolerant serial communication systems (such as UCIC and BCIC architectures). This approach enables efficient problem diagnosis and resolution, and is essential for systems requiring maximum reliability, such as systems-on-chip (SoC) or systems-on-wafer (SoW).
• Comprehensive test strategies:
  • FCT (Functional) Tests and In-Circuit Tests (ICT).
  • X-ray testing.
  • High-power systems and robotics testing.
• The Smartest Station™: This revolutionary turnkey measurement solution allows for the creation of electronic tests at a fraction of the cost. It is more comprehensive than a standalone In-Circuit Test (ICT) (as it also tests functionality) and more flexible than an AOI.